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Synopsys (NasdaqGS:SNPS) expanded its collaboration with TSMC, rolling out certified design flows and new IP for advanced process nodes. The two companies introduced agentic AI features within Synopsys design tools to support complex AI, HPC and edge computing chips. Synopsys and Alchip Technologies reported new technical results on ultra high density chip to chip interconnects for AI data center hardware. These fresh Synopsys partnerships on AI design flows and ultra dense interconnects...
Collaboration features high-speed SerDes, advanced packaging and SI/PI expertiseSAN JOSE, Calif., Sept. 23, 2026 (GLOBE NEWSWIRE) -- Today at the TSMC 2026 North America Open Innovation Platform® (OIP) Ecosystem Forum, Alchip Technologies presented a technical paper with Synopsys on how AI data center ASICs can overcome increasingly stringent bandwidth requirements as scale-up and out interfaces become critical to next‑generation system architectures. This approach brings together Synopsys 224G
Highlights 3nm Production, 2nm Design, 3DIC Capabilities and Multi-Die Advanced PackagingSAN JOSE, Calif., Sept. 14, 2026 (GLOBE NEWSWIRE) -- Alchip Technologies, the high-performance ASIC leader, will showcase its leading-edge process technology and advanced packaging achievements in Booth 1705 at AI Infra Summit 2026. The event runs from September 15 through September 17 at the Santa Clara Convention Center in Santa Clara, California. At the exhibit, Alchip will discuss its 3nm designs in prod
Üçüncü taraf yayıncıların bu şirket hakkındaki son başlıkları; Makkler'in kendi editoryal içeriğinden ayrı tutulur ve dış kaynağa yönlendirir. Başlıkların doğruluğu ilgili yayıncının sorumluluğundadır.