Taiyo Holdings Co., Ltd. 4626

Taiyo Holdings Co., Ltd. (Securities code: 4626; hereinafter "Taiyo Holdings"), based in Tokyo, presented a paper on September 10, 2026, at the 11th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2026), held in Helsinki, Finland, on the "FPIM Series" (hereinafter the "Material"), a next-generation semiconductor-packaging material. The FPIM Series is a fine-pitch RDL (*1) negative-tone i-line photosensitive insulating material for dual damascene processes.

KKR has proposed an acquisition and privatization of Taiyo Holdings, and the board has resolved to support the tender offer. The company has revised its dividend policy, including suspending the year end dividend in connection with the proposed transaction. These decisions affect the ownership structure of Taiyo Holdings and how cash returns to shareholders are handled going forward. Taiyo Holdings (TSE:4626), trading at ¥4,745.0, has recorded share price gains of 329.6% over 3 years and...