Lintes Technology Co., Ltd. 6715

Lintes Technology (TWSE: 6715), a global leader in high-bandwidth connectivity solutions, today announced the launch of its comprehensive, modular optoelectronic interconnect solution for next-generation AI servers. Addressing the critical bottleneck of high-density data centers, the platform encompasses both Near-Packaged Copper (NPC) and Near-Packaged Optics (NPO) technologies, featuring a shared patented socket architecture.

Driven by surging AI demand, Lintes Technology (TWSE: 6715), a leading provider of high-speed interconnect solutions, reported a 17.2% year-over-year increase in Q1 revenue and expects continued strong growth momentum throughout 2026. In response to future market growth, Lintes is fully upgrading to flexible and replicable automated production lines, ensuring it fulfills global customers' large-scale mass production needs.