E&R Engineering Corp. 8027

E&R Engineering Corp. (Taipei Exchange: 8027), a specialist in semiconductor laser and plasma processing equipment, will showcase its latest technologies at SEMICON Taiwan 2026. Highlights will include high-precision laser drilling for Fiber Array Units (FAUs), Glass Core and Through-Glass Via (TGV) processing, Glass Carrier applications, and the PHB-600A laser processing system and R-300R Hybrid Plasma System.

E&R Engineering (8027.TW) will showcase advanced laser and plasma solutions at SEMICON Southeast Asia 2026 next week. Targeting critical demands in AI, CPO, and next-generation manufacturing, E&R is partnering with Horng Terng Automation (HTA) and Group Up Industrial (GP) to deliver a fully integrated turnkey solution:

E&R Engineering Corp. (8027.TW), a leading provider of innovative semiconductor process equipment, will participate in the International Semiconductor Industry Group (ISIG) Symposium, April 20–21, at the Plug and Play Tech Center in Sunnyvale, California.

Semiconductor equipment supplier E&R Engineering Corp. (8027.TW)today announced its new office in Hillsboro, Portland. Following the establishment of its Phoenix, Arizona site, this second North American hub marks a milestone in providing localized support within the U.S. semiconductor ecosystem.