Markt geschlossen· · HKD · Daten können verzögert sein
Kurse können verzögert sein und dienen nur zu Informationszwecken - keine Anlageberatung.
Gesamtrendite inklusive Dividenden.
Driven by booming AI‑led innovation, advanced packaging evolution and global supply‑chain realignment, the electronics manufacturing industry is undergoing profound transformation, with Asia accounting for more than 58% of worldwide electronics production output. As Asia's premier PCBA and smart‑manufacturing event rooted in Shenzhen — China's core electronics‑manufacturing hub — NEPCON ASIA 2026 will take place from October 27 to 29 at Shenzhen World Exhibition & Convention Center (Bao'an), off
ASMPT Ltd (ASMVF) reports robust revenue and bookings growth in the first half of 2026, fueled by advancements in AI and strong semiconductor demand.
ASMPT Limited (OTC:ASMVY) is one of the fastest-growing high-bandwidth memory stocks to buy. The company sharpened its HBM relevance on June 8, 2026, when it announced a repeat order for eight chip-to-wafer Thermo-Compression Bonding tools from a leading global integrated device manufacturer. ASMPT said the order followed the customer’s use of its Firebird TCB tools […]
ASMPT LTD. - Unsponsored ADR (ASMVY) could be a great choice for investors looking to make a profit from fundamentally strong stocks that are currently on the move. It is one of the several stocks that made it through our "Recent Price Strength" screen.
Applied Materials (NasdaqGS:AMAT) is acquiring ASMPT's NEXX business, adding advanced panel level packaging tools to its portfolio. The deal is directly linked to Applied Materials' recent AI chip development work with TSMC and global academic partners at the EPIC Center. Together, these moves expand Applied Materials' role in packaging technologies used for next generation AI chip designs. For you as an investor, this development sits at the intersection of equipment, packaging, and AI...
Aktuelle Schlagzeilen Dritter zu diesem Unternehmen, getrennt von Makklers eigener Redaktion und mit Verlinkung zum Herausgeber. Für die Richtigkeit ist der jeweilige Herausgeber verantwortlich.