E&R Engineering Corp. 8027
TPEX · Taiwan · Producer Manufacturing
TWD 213.50+4.00 (+1.91%)
Market closed· · TWD · Data may be delayed
Prices may be delayed and are for informational purposes only - not investment advice.
Market closed· · TWD · Data may be delayed
Prices may be delayed and are for informational purposes only - not investment advice.
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E&R Engineering Corp. (Taipei Exchange: 8027), a specialist in semiconductor laser and plasma processing equipment, will showcase its latest technologies at SEMICON Taiwan 2026. Highlights will include high-precision laser drilling for Fiber Array Units (FAUs), Glass Core and Through-Glass Via (TGV) processing, Glass Carrier applications, and the PHB-600A laser processing system and R-300R Hybrid Plasma System.
E&R Engineering (8027.TW) will showcase advanced laser and plasma solutions at SEMICON Southeast Asia 2026 next week. Targeting critical demands in AI, CPO, and next-generation manufacturing, E&R is partnering with Horng Terng Automation (HTA) and Group Up Industrial (GP) to deliver a fully integrated turnkey solution:
E&R Engineering Corp. (8027.TW), a leading provider of innovative semiconductor process equipment, will participate in the International Semiconductor Industry Group (ISIG) Symposium, April 20–21, at the Plug and Play Tech Center in Sunnyvale, California.
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