Market open· · USD · Data may be delayed
Prices may be delayed and are for informational purposes only - not investment advice.
SUNNYVALE, Calif., September 29, 2026--Alpha and Omega Semiconductor Limited ("AOS") (Nasdaq: AOSL), today announced management’s participation in the 18th Annual CEO Investor Summit, being held Tuesday, October 13th, 2026 at the St. Regis Hotel in San Francisco, California.
SUNNYVALE, Calif., September 08, 2026--αMOS E2™ 600V Super Junction High‑Voltage MOSFETs meet the growing demands for enhanced efficiency and increased power density management capabilities
The shift to 800-volt AI rack architectures is quietly creating winners in a corner of the chip market most investors overlook, and three small-cap semiconductor names under $50 each carry real exposure to that buildout alongside risks that could make or break the thesis.
While Wall Street crowds into the same AI megacaps, the real infrastructure buildout runs through specialty chip names that most desks barely touch, and three of them are quietly posting explosive growth metrics that generalist money has yet to notice.
Moby summary of Alpha and Omega Semiconductor Limited's Q4 2026 earnings call
Gross margins improve 200 basis points as record advanced computing revenue and a 60% AI server growth outlook signal a strategic pivot toward high-performance markets.
SUNNYVALE, Calif. (AP) — Alpha and Omega Semiconductor Ltd. (AOSL) on Wednesday reported a loss of $13.1 million in its fiscal fourth quarter. The Sunnyvale, California-based company said it had a loss of 43 cents per share. For the current quarter ending in September, Alpha and Omega said it expects revenue in the range of $166 million to $186 million.
SUNNYVALE, Calif., August 12, 2026--Alpha and Omega Semiconductor Limited ("AOS") (NASDAQ: AOSL), today reported financial results for the fiscal fourth quarter and the fiscal year ended June 30, 2026.
Earlier in July 2026, Alpha and Omega Semiconductor introduced the AOPL66801, an 80V half-bridge MOSFET using vertically stacked die packaging to boost power density and efficiency for applications from AI data centers to power tools. This launch highlights how the company is using advanced packaging and integrated half-bridge designs to save PCB space, cut switching losses, and enhance system-level performance in demanding power-conversion markets. We’ll now examine how this advanced...
Recent third-party headlines about this company, kept separate from Makkler's own editorial coverage and linking out to the publisher. Accuracy is the publisher's responsibility.