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Besi joins Applied's EPIC Center as an Innovation Partner, extending a collaboration that began in 2020 with the companies' joint Hybrid Bonding Center of Excellence in SingaporeExpanded collaboration targets next-generation 3D IC scaling, logic and memory integration, and photonics applications supporting AI infrastructure build-outPartnership expands beyond die-to-wafer hybrid bonding to new hybrid bonding platforms, scaling of thermo-compression bonding (TCB), and new die-on-wafer, die-on-die
Investing.com -- Global chip stocks rose on Tuesday after Reuters reported that AI startup Anthropic’s IPO prospectus showed it expects $518 billion in cloud, computing and infrastructure commitments over the coming year.
Investing.com - European stock bourses reversed course on Tuesday, closing lower, as investors continued to digest a spike in global bond yields and oil volatility.
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