China Wafer Level CSP Co., Ltd. Class A 603005
SSE · China · Electronic Technology
CNY 26.99-0.87 (-3.12%)
Market closed· · CNY · Data may be delayed
Prices may be delayed and are for informational purposes only - not investment advice.
Market closed· · CNY · Data may be delayed
Prices may be delayed and are for informational purposes only - not investment advice.
| Ex-date | Per share |
|---|---|
| 2026-05-18 | CNY 0.12 |
| 2025-07-04 | CNY 0.084 |
| 2024-05-24 | CNY 0.046 |
| 2023-07-10 | CNY 0.07 |
| 2022-05-20 | CNY 0.283 |
| 2021-06-15 | CNY 0.1643 |
| 2020-05-19 | CNY 0.0583 |
| 2019-04-15 | CNY 0.0408 |
| 2018-06-21 | CNY 0.0495 |
| 2017-05-12 | CNY 0.0297 |
Dividends are listed by ex-date. Declaration, record and payment dates come from the exchange calendar; amounts are shown as declared and are not adjusted for stock splits. The per-year chart below uses the split-adjusted series instead, so the table and the chart can differ for older years. The payout ratio divides the dividends that went ex in the last twelve months by trailing earnings per share. Not investment advice.